SSI

As demand for electronic devices with higher amperage and reduced voltage escalates, the challenge to produce interconnects to support this trend intensifies. In workstation and servers, the corresponding trend is for power supply interconnects to be able to support hot-swapping, enable high thermal resilience during Infrared or conventional reflow soldering, provide ease of mating and possess good durability characteristics. To meet this challenge, Molex has introduced a new power connector series which conforms to Intel's Server System Infrastructure (SSI) open specifications - the DPS (Distributed Power Systems) and MPS (Mid-Range Chassis Power Systems) connectors.
Molex's DPS and MPS power connectors feature recessed pins-sequential mating (Last-Mate-First-Break) that allows hot-swapping of power supply units. The headers' new mixed-layout blade-type contacts support up to 30 amperes of current and their shrouded design ensure the metal contacts are well protected against physical damage during mating and unmating. The guide posts along each end of the receptacles provide low insertion force and facilitate easy blind mating as they fit smoothly into the guide pockets of the headers. The connectors are made of high temperature thermoplastic housing material to ensure thermal reliability, and come in tray packaging.
Molex offers through-hole right angle headers and receptacles, and through-hole vertical receptacles. Vertical receptacles in press-fit designs are available upon request. Molex's MPS (upper pair) and DPS (lower pair) series of power connectors