| Pitch |
Board-to-Board
Families |
| 0.40
mm (.016") |
 |
SlimStack™0.40mm
(.016") Pitch
SlimStack 0.4 is the newest and smallest pitch addition
to the SlimStack micro SMT Board-to-Board connector family. |
| 0.50
mm (.020") |
 |
SlimStack™0.50mm
(.020") Pitch
Two-Piece 0.50 mm (.020") pitch SMT Board-to-Board connector
system. |
| 0.635
mm (.025") |
 |
SlimStack™0.635mm
(.025") Pitch
0.635 mm (.025") pitch SMT Board-to-Board connector system. |
| 0.635
mm (.025") |
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Twin-Stack™
0.635 mm (.025") pitch, two-piece, SMT board-to-board connector
system with mating heights ranging from 5.00 mm (.197")
to 16.00 mm (.620"). |
| 1.00
mm (.039") |
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Mezzanine
1.00mm (.039") Pitch
1.00 mm (.039") pitch. A compact, SMT connector system in
multiple mated heights for adding mezzanine cards to VMEbus
and Multibus host boards. |
| 1.00 mm (.039") |
 |
Compression Connectors
Molex Compression Connectors -- New Solutions For Improved Design Flexibility and Space Savings |
| 1.00
mm (.039") |
 |
Detachable
Board-to-Board
1.00 mm (.039") to 2.20 mm (.087") pitch panel detachable
board-to-board connectors. Available in two-piece and one-piece
systems. |
| 1.00
mm (.039") |
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ZYTON
1.00 mm (.039") pitch. Offered in two different low stack
height profiles for applications that require close parallel
board stacking. |
| 1.27
mm (.050") |
 |
SliderZ
A 1.27mm (.050") pitch, one-piece, board-to-board connector
system that uses a "slide" action in the vertical Z-axis. |
| 1.27
mm (.050") |
 |
SCA-2
1.27 mm (.050") pitch. Complete solution for linking storage
devices within the SCA-2 interconnection standards for 40-pin
Fibre Channel and 80-pin SCSI. |
| 1.27
mm (.050") |
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D-50L
1.27 mm (.050") pitch. Leaf-style connector system available
in both vertical and right angle forms. |
| 1.27
mm (.050") |
 |
EBBI™50D
1.27 mm (.050") pitch leaf-style connectors carry all required
signals, power and auxilliary signals within one interface
for various mass storage applications. |
| 1.27
mm (.050") |
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LFH™
(Low Force Helix) 1.27 mm (.050") pitch, high density connectors
for high-pin-count signal applications. |
| 1.27
mm (.050") |
 |
SCSI+
1.27 mm (.050") pitch. Small Computer Systems Interface. |
| 1.27
mm (.050") |
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SSA
1.27 mm (.050") pitch 38 circuit connector with four unitized
bays to connect drives and other media devices to backplanes
and IDT cables. |
| 2.00
mm (.079") |
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HDM
2.0 mm (.079") pitch. The 6-row High Density Metric (HDM)
connector system is designed for applications that require
high interconnect density and high-speed signal integrity.
HDM is a registered trademark of Teradyne, Inc. |
| 2.00
mm (.079") |
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MFB™
MFB (Futurebus+) connector system is a modular 2.00mm (.079")
grid system for high-density, board-to-board and cable-to-board
applications. MFB is available in 4- and 5-row versions
and complies with hard metric packaging standards. |
| 2.00
mm (.079") |
 |
Milli-Grid™
2.00 mm (.079") pitch. Molex's Milli-Grid family of high
density connectors is based on a 2.00 x 2.00mm grid pattern. |
| 2.00
mm (.079") |
 |
VHDM
The 2.00 mm (.079") pitch Very High Density Metric (VHDM)
connector system is available in 6- and 8-row versions and
is designed for B-to-B applications that require very high
interconnect density and high speed signal integrity.
VHDM is a registe |
| 2.50
mm (.090") |
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KK¨
2.50 mm (.098") to 5.08 mm (.200") pitch Wire-to-Board,
Board-to-Board interconnect systems. |
| 2.50
mm (.090") |
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Omnigrid¨
2.50mm (.098") pitch, 5 row true metric system, design flexibility
of pin and socket modules. Complies with IEC 1076-4-100
and Bellcore specifications |
| 2.50
mm (.090") |
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SPOX™
2.50 mm (.098") to 5.08 mm (.200") pitch springbox contact
design WTB system. |
| 2.50
mm (.090") |
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User
Friendly
2.50 mm (.098") pitch WTB connector system. |
| 2.54
mm (.100") |
 |
C-Grid¨
/ SL Products
2.54 mm (.100") pitch grid interconnection products: C-Grid,
the dual row, board-to-board system and SL™, the modular,
single row wire-to- board and wire-to-wire system. |
| 2.54
mm (.100") |
 |
DIN
41612
2.54 mm (.100") pitch, 3 Row DIN 41612 and IEC 603-2 Standards.
VME and Multibus associated Busses. |
| 2.54
mm (.100") |
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SSI
2.54 mm (.100") pitch grid. DPS/MPS power connectors meet
Intel's SSI (Server System Infrastructure) specifications. |
| 3.00
mm (.118") |
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Micro-Fit,
3.0™
3.00 mm (.118") pitch signal/power connector capable of
handling up to 5 amps/circuit. Available in through-hole
and SMT. |
| 4.20
mm (.165") |
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Mini-Fit,
BMI™
4.20 mm (.165") pitch, Blind Mate Interface, allows up to
9 amperes per circuit and a misalignment of up to .100".
|
| 4.20
mm (.165") |
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Mini-Fit,
CPI™
4.20 mm (.165") pitch Compliant Pin Interface. Press-Fit
headers eliminate the need for soldering and allow up to
8 amps/circuit. |
| 4.20
mm (.165") |
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Mini-Fit,
SMC™
4.20 mm (.165") pitch Surface Mount Compatible. Allows up
to 12 amps/circuit. |
| 5.00
mm (.197") |
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One
Piece
5.00 mm (.197") pitch terminal for PCB edge mating in white
goods harnesses. |
| Mixed
Layout |
 |
COMPODRE™
Mixed layout connector system with signal and power modules
that use Mini-Fit, Sr.™, Mini-Fit, Jr.™, and Micro-Fit
3.0™ terminals. |
| Various |
 |
Battery Connectors
While many applications will require a custom designed battery connector, Molex is also able to offer various battery connectors as standard products. |
