VHDM - HSD
VHDM
HDM
MZP"
MFB "
Omnigrid¨
DIN 41612
MT High Density
Backplane
Interconnect
System (HBMT)
MTP Backplane
Interconnect
System (BMTP)
LC Backplane
Connector System
(BLC)
SC Backplane
Connector System
(BSC/BSCII)
FlexPlane
Across the Board Backplane Solutions
HDM and VHDM Mixed Layout Design Guide
   

Backplane
Speed/
Bandwidth
Backplane Families
5.0 Gbps VHDM - HSD
The 8-row 2.00 mm (.079") Very High Density Metric High Speed Differential connector system is designed for BTB applications that require higher speed signal integrity than the standard VHDM.
VHDM-HSD is a registered trademark of Teradyne, Inc.
2.5 Gbps VHDM
The 2.00 mm (.079") pitch Very High Density Metric (VHDM) connector system is available in 6- and 8-row versions and is designed for B-to-B applications that require very high interconnect density and high speed signal integrity.
VHDM is a registe
1.5 Gbps HDM
2.0 mm (.079") pitch. The 6-row High Density Metric (HDM) connector system is designed for applications that require high interconnect density and high-speed signal integrity.
HDM is a registered trademark of Teradyne, Inc.
1.0 Gbps MZP™
2.00mm, 5 Row, IEC 1076-4-101 and Hard Metric (HM) standard compliant. Compact PCI (CPCI) Bus.
0.622 Gbps MFB
MFB (Futurebus+) connector system is a modular 2.00mm (.079") grid system for high-density, board-to-board and cable-to-board applications. MFB is available in 4- and 5-row versions and complies with hard metric packaging standards.
0.622 Gbps Omnigrid¨
2.50mm (.098") pitch, 5 row true metric system, design flexibility of pin and socket modules. Complies with IEC 1076-4-100 and Bellcore specifications
0.622 Gbps DIN 41612
2.54 mm (.100") pitch, 3 Row DIN 41612 and IEC 603-2 Standards. VME and Multibus associated Busses.
Fibre Optic MT High Density Backplane Interconnect System (HBMT)
Utilizing a standard MT ferrule as the optical interface, the HBMT provides up to 96 Fibre interconnects.
Fibre Optic MTP Backplane Interconnect System (BMTP)
Based on the NTT MT ferrule and MTP push-pull ribbon Fibre connector, the BMTP interconnect is a high density solution for today's space constrained Fibre optic systems.
Fibre Optic LC Backplane Connector System (BLC)
Our BLC is specifically designed to provide a smooth transition from the PC board mounted and pigtailed active devices to the backplane Fibre optic components using a standard LC interface.
Fibre Optic SC Backplane Connector System (BSC/BSCII)
The BSC and BSCII backplane connector systems have been designed to provide a smooth transition from the board mounted and pigtailed devices (LED's, lasers, receivers, and WDM devices) to the SC based Fibre optic network.
Fibre Optic FlexPlane
For high Fibre count interconnects in backplanes and cross-connect systems, Molex's FlexPlane™ high density routing on a flexible, flame-resistant substrate provides a manageable means of Fibre routing from card-to-card or shelf-to-shel

 

 

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