Overview (PDF)
Introduction
Features and Benefits
Selection Matrix
Backplane
Daughtercard
HDM and VHDM Mixed Layout Design Guide
Stacking Brochure
Technical Specifications
   

Features and Benefits


 

 

Feature Benefit
2mm 6-row connector provides 30 contacts per centimeter  
Designed for high-density/high-speed applications--internal shielding allows sub nanosecond rise times with low crosstalk (see HDMPLUS)  
Shielded and unshielded modules mate with the same backplane header (low cost on backplane)  
Mix and match signal, power, guidance, shielded modules to optimize the connector to the application  
Multiple sourced connector (available from Molex and Teradyne) assures intermateability and interchangeability  
45A power modules  
Tail lengths available in 0.5mm increments to optimize to PCB thickness  
Very low insertion force (0.35N per contact) allows very high pin counts with reasonable mating forces (Approx. 5.5 lb/inch of connector length)  
Both press-fit and solder tail versions available for backplane and daughtercards  
Meets Bellcore requirements  


 

 

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