· Wire-to-Wire
· Wire-to-Board
· Board-to-Board
· Backplane
· Memory Card
· Sockets/Edge Card
· Flat Flex/Cable
· Solderless Terminals
· Fibre Optics
· Modular Plugs/Jacks
· Shielded I/O
· Circular Industrial
· Switches
· Cable Assemblies
· Application Tooling
· Thermal/ Acoustic
   

Mini MiII

Mini MiII
Molex's 1.25mm (.049") pitch Mini MiII™ system is designed for high-density harness applications. Mini MiII provides the same 1.5 amperes of current as similar 2.00mm (.079") pitch systems, but in a more compact design.

The new Mini MiII system is offered in wire-to-board and wire-to-wire options and enables multi-branch harnessing configurations, similar to Molex's existing 2.00mm (.079") pitch MiII system. The system saves about 45% of PCB space compared to 2.00mm MiII. Mini MiII is available in 2 to 40 circuits in single/dual row and SMT/through-hole styles.

A full range of automatic, semi-automatic and manual tooling is available to support IDT harness assembly for discrete wire.
 


 

 

 

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