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· Wire-to-Wire
· Wire-to-Board
· Board-to-Board
· Backplane
· Memory Card
· Sockets/Edge Card
· Flat Flex/Cable
· Solderless Terminals
· Fibre Optics
· Modular Plugs/Jacks
· Shielded I/O
· Circular Industrial
· Switches
· Cable Assemblies
· Application Tooling
· Thermal/ Acoustic |
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Mini MiII
| Mini MiII |
Molex's
1.25mm (.049") pitch Mini MiII system is designed for
high-density harness applications. Mini MiII provides the same
1.5 amperes of current as similar 2.00mm (.079") pitch systems,
but in a more compact design.
The new Mini MiII system is offered in wire-to-board and wire-to-wire
options and enables multi-branch harnessing configurations,
similar to Molex's existing 2.00mm (.079") pitch MiII system.
The system saves about 45% of PCB space compared to 2.00mm MiII.
Mini MiII is available in 2 to 40 circuits in single/dual row
and SMT/through-hole styles.
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full range of automatic, semi-automatic and manual tooling is
available to support IDT harness assembly for discrete wire. |
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